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Kerwin Tsao
Function Adhesives Division Deputy Manager
Eternal Materials Co.,Ltd. -
Personal Biography:
- Ph.D., Chemistry, National Tsing Hua University.
- A technical head in the function adhesives division
- More than ten years of experience in the development and application of UV adhesive materials
- Mainly involves UV electronic adhesives, UV structural adhesives, UV Conformal coating, UV pressure-sensitive adhesives in 3C electronics, new energy adhesive related applications
Presentation title:
Dual-curing adhesive technology in electronic and new energy vehicle applicationsAbstract:
UV curing technology has certain limitations because of the UV light is not reachable in shadow area of the object during the curing process. Also, the liquid state might cause the risks such as corrosion and loss of bonding strength. Recently, Eternal has been committed to developing a variety of dual-curing products, include UV-thermal, UV-moisture or UV-cation curing types, and they are suitable for wild applications, such like the automotive electronics, 3C electronics, conformal coating, bonding technical adhesives, and other fields.
The epoxy-modified acrylate resins, synthesized with epoxy and acrylic bi-functional groups, after cationic curing, promote epoxy ring opening and polymerization with double bonds. Therefore, the cured adhesives exhibit higher strength and hardness, and provide their durability to chemical and thermal environment. Furthermore, the Silane-modified acrylates, by introducing acrylic-silane or epoxy-silane and condensation with catalyst, provide high flexibility and bonding strength to achieve better compensation of modulus.
UV/LED initial cure provides production accuracy within seconds. Moreover, Eternal products have low-temperature curing (60-100°C) characteristics, achieving a complementary mechanism of full curing and cross-linking. The dual-curing adhesives offer supplementary curing mechanisms of UV-curing, thus simplifying the manufacturing processes, facilitating automation, ensuring reliability of processing quality and maximizing the flexibility of different manufacturers.